发明名称 WIRING BOARD MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which prevents an electrical short circuit between signal wiring and a power supply conductor, or between power supply conductors different from each other in a clearance portion.SOLUTION: A wiring board manufacturing method comprises the steps of: forming on an insulation layer 1 or 2 in a lower layer, a power supply conductor P in a lower layer, on which a plurality of rectangular gassing opening A, 100-300 μm on each side are formed at an arrangement pitch of 300-1000 μm in a matrix shape; laminating on the insulation layer 1 or 2 in the lower layer, an insulation layer 2 in an upper layer so as to cover the power supply conductor P in the lower layer; and forming on the insulation layer 2 in the upper layer by a semi-additive method, circular via lands 9 each having a diameter of 80-150 μm and power supply conductors P in the upper layer, which are arranged to surround the via lands 9 via respective clearances C each having a width of 30-100 μm. The openings A and the clearances C are arranged not to be arranged one above the other.SELECTED DRAWING: Figure 3
申请公布号 JP2016184768(A) 申请公布日期 2016.10.20
申请号 JP20160145021 申请日期 2016.07.25
申请人 KYOCERA CORP 发明人 HIWATARI TOSHIHIRO
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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