| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment device which can prevent warpage occurring in a thin substrate to allow uniform heat treatment on the thin substrate.SOLUTION: In a heat treatment device, when a pressing member 10 descends, a rib region 101 of a substrate 100 is pressed by a pressing part 11 of the pressing member 10 and the rib region 101 is sandwiched between the pressing part 11 and a surface of a hot plate 20. At this time, a height regulation part 12 of the pressing member 10 abuts against the surface of the hot plate to regulate a height position of the pressing part 11. This makes it possible to press the rib region 101 as an edge of the substrate 100 to the hot plate 20 by the pressing part 11 at a constant pressing force.SELECTED DRAWING: Figure 6 |
