PLATING APPARATUS AND CONTAINER BATH

摘要

Provided are a plating apparatus and a container bath, which have a simpler structure than a conventional system and are capable of improving uniformity of a plating thickness. The plating apparatus includes a plating tank which stores a plating liquid, a cathode member arranged inside the plating tank, a plating object arranged inside the plating tank to face the cathode member, an anode jig which contacts with the plating object, and a space formed between the cathode member and the plating object to be a flow passage to which the plating liquid flows from the plating tank. The plating liquid flows into the space from above relative to the space, and is sucked by a pump from below relative to the space.

主权项

1. A plating apparatus, comprising:
a plating tank storing a plating liquid; a cathode member arranged inside the plating tank; a plating object arranged inside the plating tank to face the cathode member; an anode member contacting with the plating object; and a space formed between the cathode member and the plating object to be a flow passage to which the plating liquid flows from the plating tank, wherein the plating liquid flows into the space from above relative to the space, and is sucked by a pump from below relative to the space.