| 摘要 |
An electronic component includes a housing, a heat-generating component, a heat sink, and a sealing element. The housing is made of a first metallic material. The heat-generating component is disposed in the housing. The heat sink, which is made of a second metallic material, is disposed adjacent the heat-generating component and configured to dissipate heat from the heat-generating component. The sealing element is disposed between the housing and the heat sink and insulates the second metallic material from the first metallic material. |
