| 摘要 |
PROBLEM TO BE SOLVED: To maintain a large productivity and a low cost even when a plurality of kinds of components are buried and mounted together.SOLUTION: A component built-in wiring board comprises: a second insulating layer having in a laminated manner a first layer closest to a first insulating layer, a second layer secondly closest to the first insulating layer and having first and second penetrating openings, and a third layer thirdly closest to the first insulating layer, the first, second, and third layers being located on the first insulating layer in a laminated state; a semiconductor element rushed into the first opening, buried in the second insulating layer with a height not reaching a boundary between the second and third layers, and provided with a surface mounting terminal of a grid array; an electric/electronic component rushed into the second opening, and buried in the second insulating layer with a height reaching the boundary between the second and third layers; a wiring pattern provided between the first and second insulating layers, and including a land for buried component; a first connection member connecting between the surface mounting terminal of the semiconductor element and the land; and a second connection member connecting between the electric/electronic component and the land, and formed of the same material as the first connection member. |
