| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealant for flip chip mounting, excellent in dispensing property, and capable of manufacturing a highly reliable semiconductor chip mounting body by favorably performing electrode junction, and also to provide a method for manufacturing the semiconductor chip mounting body using the sealant for flip chip mounting.SOLUTION: A sealant for flip chip mounting contains an epoxy compound, an epoxy hardener, a hardening accelerator, an inorganic filler and a viscosity regulating agent. The viscosity regulating agent is a thermoplastic resin particle or a reactive monomer, has a viscosity measured at 25°C using an E-type viscometer of 10-200 Pa s, and has a melt viscosity measured at 150°C using a rheometer of 100-10,000 Pa s. |
