发明名称 ヒートシンクの製造方法およびヒートシンク一体型半導体モジュールの製造方法
摘要 PROBLEM TO BE SOLVED: To securely place fins in surface contact with a fin base thereby stabilizing heat radiation performance of a heat sink.SOLUTION: A heat sink includes: a fin base having caulking parts, each of which is disposed between facing protruding wall parts and has a two pronged tip, and multiple fins, each of which is disposed between the caulking part of the fin base and the protruding wall part, is caulked to be fixed thereto, and is harder than the fin base. In each protruding wall part of the fin base, both side surfaces may be inclined and a root part may be wider than an upper end part.
申请公布号 JP6009209(B2) 申请公布日期 2016.10.19
申请号 JP20120100632 申请日期 2012.04.26
申请人 三菱電機株式会社 发明人 三田 泰之;古森 秀樹;中島 泰;芳原 弘行;北井 清文
分类号 H01L23/36 主分类号 H01L23/36
代理机构 代理人
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