发明名称 半導体装置及びその製造方法
摘要 According to one embodiment, a semiconductor device includes a MRAM chip including a semiconductor substrate and a memory cell array area includes magnetoresistive elements which are provided on the semiconductor substrate, and a magnetic shield layer separated from the MRAM chip, surrounding the memory cell array area in a circumferential direction of the MRAM chip, and having a closed magnetic path.
申请公布号 JP6010005(B2) 申请公布日期 2016.10.19
申请号 JP20130186599 申请日期 2013.09.09
申请人 株式会社東芝 发明人 野間 賢二
分类号 H01L21/8246;H01L27/105;H01L43/02;H01L43/08 主分类号 H01L21/8246
代理机构 代理人
主权项
地址