发明名称 発光モジュール、照明装置および照明器具
摘要 PROBLEM TO BE SOLVED: To improve reliability of a wire which connects an LED and a wiring pattern while improving color unevenness of output light in an LED lighting device.SOLUTION: In a light-emitting module 10 of a lighting device 6, a first light-emitting group and a second light-emitting group which emit light with a different color temperature are alternately arrayed on a substrate 11, and LED chips 13 located at both ends out of a plurality of LED chips 13 included in the second light-emitting group cross over wiring patterns 15a and 15c by a wire 19 and are connected to wiring patterns 15b and 15d supplying drive current to the second light-emitting group. Furthermore, the plurality of LED chips 13 and the wire 19 included in the second light-emitting group are collectively sealed by a second sealing member.
申请公布号 JP6008290(B2) 申请公布日期 2016.10.19
申请号 JP20120288046 申请日期 2012.12.28
申请人 パナソニックIPマネジメント株式会社 发明人 石森 淳允;緒方 俊文;阿部 益巳
分类号 H01L33/54;F21S2/00;F21S8/02;F21V9/08;F21V19/00;F21V23/00;H01L33/62 主分类号 H01L33/54
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