| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for sticking a protective member on a wafer at a proper position thereof by means of an annular adhesive layer that is formed so as to face a peripheral surplus region.SOLUTION: A method for sticking a protective member on a wafer that has a surface formed of device regions and a peripheral surplus region by means of an annular adhesive layer that is formed so as to face the peripheral surplus region, includes the steps of: forming an annular adhesive layer by applying liquid resin on the peripheral surplus region of the wafer by relatively rotating holding means and liquid resin applying means while the liquid resin applying means is dropping from above the liquid resin on the peripheral surplus region of the wafer as held on an upper surface of the holding means (step ST3); sticking the protective member on the wafer by bringing the protective member, which is broader than the wafer, into contact from above the wafer with the annular adhesive layer at a position covering the entire wafer (step ST4); and removing the protective member and the adhesive layer that stick out from the periphery of the wafer (step ST5). |
