发明名称 DEVICE MODULE AND METHOD OF MANUFACTURING THE DEVICE MODULE
摘要 The invention provides a device module capable of preventing plastic material from flowing into a housing recess of a die for housing a part of the external connection and facilitating the part of the external connection to be inserted into the housing recess of the die. A method of manufacturing the device module is also provided. A device module includes a plastic part 200, a touch sensor 300 embedded in the plastic part 200, a holder 500 embedded in the plastic part 200, and an external connection 400 connected to the touch sensor 300 and partially fixed to the holder 500. The holder 500 has an exposed portion 520 exposed from the plastic part 200 in the thickness direction D1 in such a manner as to close a housing recess 12 of a die. The external connection 400 has a lead-out portion 420 insertable into the housing recess 12 of the die. The lead-out portion 420 is led through and out of the holder 500 in the thickness direction D1.
申请公布号 EP2695717(B1) 申请公布日期 2016.10.19
申请号 EP20130250086 申请日期 2013.07.25
申请人 HOSIDEN CORPORATION 发明人 ISODA, TAKESHI;SHINODA, KOJI
分类号 B29C45/14;B29C45/26;H01L23/498 主分类号 B29C45/14
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