发明名称 構造材接合方法および接合構造
摘要 A first structural material is bonded to a second structural material with a joining material provided with a mixed layer of a raw-material component for forming an intermetallic compound layer and a resin component that softens and flows during heat treatment interposed therebetween to form bonded structural materials. When the bonded structural materials are heat-treated, the first structural material is joined to the second structural material with an intermetallic compound layer, and the resin component exudes and covers the lateral circumferential (exposed) portion of the intermetallic compound layer with a resin film.
申请公布号 JP6011734(B2) 申请公布日期 2016.10.19
申请号 JP20150556801 申请日期 2015.01.06
申请人 株式会社村田製作所 发明人 石野 聡;川口 義博;中野 公介;高岡 英清;柳瀬 航
分类号 B23K20/00 主分类号 B23K20/00
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