发明名称 被水防止装置
摘要 PROBLEM TO BE SOLVED: To ensure rapidness and maintainability in water-pouring countermeasure for a semiconductor manufacturing apparatus and the like.SOLUTION: A storage container 23 is arranged above a semiconductor manufacturing apparatus. When a water leakage sensor 13 detects water leakage, sheets 27 in the storage container 23 are developed on the basis of a command of a control device 12 to prevent the semiconductor manufacturing apparatus from getting wet. Weights 28 are attached to the sheets 27 respectively. Each of the weights 28 is held in a holding part 29 in an outer edge of the storage container 23. The sheets 27 is rapidly developed by igniting an explosive 26A in the storage container 23 to increase the pressure in the storage container 23 and discharging the weights 28 to the outside.
申请公布号 JP6011115(B2) 申请公布日期 2016.10.19
申请号 JP20120167954 申请日期 2012.07.30
申请人 富士通セミコンダクター株式会社 发明人 河合 賢二;長谷川 隆史
分类号 E04H15/44;D06F57/00;E04H5/02 主分类号 E04H15/44
代理机构 代理人
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