| 摘要 |
Solder supply device 26 includes solder cup 70 that is tubular and open at one end, nozzle section 88 for for ejecting solder from the solder cup, flange section 90 that is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup, and inner tube 76 an end of which holds the nozzle section and the other end of which extends from the opening of the solder cup; the flange section is formed from material that is elastically deformable and the flange section is engaged inside the cup with an outer edge section of the flange section in an elastically deformed state. The elastic force arising between the outer edge section of the flange section and the solder cup is smaller than the holding force of the nozzle section by the inner tube. By separating the inner tube and the solder cup, the flange section integrated with the nozzle section is removed from inside the solder cup. By this, the solder cup is easily removed from the solder supply device. |
