发明名称 固体撮像装置、固体撮像装置の製造方法、及び、電子機器
摘要 PROBLEM TO BE SOLVED: To reduce image noise.SOLUTION: A solid-state imaging device comprises a pixel array portion in which multiple unit pixels are arranged on a semiconductor substrate, the unit pixels each including a photodiode generating and accumulating a light charge based on a quantity of received light and a charge accumulation portion accumulating the light charge. An intermediate electrode, which forms a charge accumulation portion together with an opposed upper electrode, is directly connected to an N-type semiconductor area of the semiconductor substrate. This technique is applicable to a solid-state imaging element, for example.
申请公布号 JP6007499(B2) 申请公布日期 2016.10.12
申请号 JP20120022724 申请日期 2012.02.06
申请人 ソニー株式会社 发明人 武田 健
分类号 H01L27/146;H01L21/822;H01L27/04;H04N5/369 主分类号 H01L27/146
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