发明名称 基板製造装置の調整方法、基板製造方法、及び基板製造装置
摘要 PROBLEM TO BE SOLVED: To provide an adjustment method for a substrate manufacturing apparatus for forming a pattern of target dimensions.SOLUTION: A substrate with an evaluation pattern formed thereon is held on a stage, a part of the evaluation pattern is imaged in an imaging area by an alignment camera, and thus, a first measurement image is acquired. The stage is moved in the imaging area, a part of the evaluation pattern other than the part of the first measurement image is imaged by the alignment camera, and thus, a second measurement image is acquired. On the basis of the first measurement image and the second measurement image, a distance between at least two points of the evaluation pattern is calculated. On the basis of the distance between two points calculated based on the first measurement image and the second measurement image, a measurement result correction coefficient to be reflected on a command from a control device to a nozzle head, is calculated.
申请公布号 JP6006133(B2) 申请公布日期 2016.10.12
申请号 JP20130022592 申请日期 2013.02.07
申请人 住友重機械工業株式会社;株式会社メイコー 发明人 岡本 裕司
分类号 B05D3/00;B05C5/00;B05C11/00;B05D1/26;G01B11/02;H05K3/10 主分类号 B05D3/00
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