发明名称 研磨パッドおよび研磨方法
摘要 PROBLEM TO BE SOLVED: To provide an abrasive pad that improves flatness and planarization efficiency of a surface to be polished, causes less occurrence of a scratch, and is usable for a long period of time.SOLUTION: The abrasive pad includes a polishing layer containing a saponified ethylene-vinyl ester copolymer in which ethylene copolymerization rate is 35-55 mol% and a crystal fusion heat quantity is 60-110 J/g. The abrasive pad is used for polishing an insulating film or metal film having a Mohs hardness of 7 or less.
申请公布号 JP6004966(B2) 申请公布日期 2016.10.12
申请号 JP20130033786 申请日期 2013.02.22
申请人 株式会社クラレ 发明人 加藤 充;菊池 博文;岡本 知大;加藤 晋哉
分类号 B24B37/24;C08F18/04;H01L21/304 主分类号 B24B37/24
代理机构 代理人
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