| 摘要 |
A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole. |
