METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A PLASTIC SUBSTRATE

摘要

A method for forming an electrically conductive structure on a plastic substrate is provided. An ink, which contains electrically conductive solid particles, is printed on the plastic substrate, where copper particles are used as electrically conductive solid particles. After the printing of the ink, only the surface regions of the plastic substrate on which the electrically conductive structure is to be formed are swept over within a vacuum chamber by means of an electron beam having a first energy per unit length, causing sintering of the copper particles.