| 摘要 |
PROBLEM TO BE SOLVED: To provide a stem for semiconductor package applicable to a plurality of light-emitting elements having different positions of emission point.SOLUTION: A stem for semiconductor package comprises: a first disc-shaped portion; a second disc-shaped portion having a diameter smaller than that of the first disc-shaped portion; and a light-emitting element fixing portion having a light-emitting element mounting surface for mounting a light-emitting element. The second disc-shaped portion is provided to project from the upper surface of the first disc-shaped portion, and to expose the outer edge of the upper surface of the first disc-shaped portion. The light-emitting element fixing portion is provided on the upper surface of the second disc-shaped portion so that the light-emitting element mounting surface is perpendicular to the upper surface of the second disc-shaped portion, and the first and second disc-shaped portions are formed eccentrically each other . |
