| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape which allows for easy determination whether or not lamination is performed under conditions suitable for the characteristics, while suppressing occurrence of die shift.SOLUTION: When the maximum length of the tape in the longitudinal direction is A and the maximum length of the tape in the width direction is B, in a sticking area P of a wafer processing tape 1 where tension is applied most during lamination, a marking 9 is provided in a region where A is 2-10 mm and B is 2-20 mm. Consequently, change in the shape of the marking 9 can be determined visually and easily. A determination can be made easily whether or not lamination is performed under conditions suitable for the characteristics, and occurrence of die shift in the following dicing step can be suppressed. |
