| 摘要 |
A sheet adhesion apparatus (1) comprises a frame receiving unit (3) receiving a ring frame (RF) boned to a wafer (WF) with an adhesion sheet (AS), a support unit (7) supporting the ring frame (RF) among the wafer (WF) and the ring frame (RF), a movement mounting unit (8) mounting the support unit (7) by extracting the ring frame (RF) from the frame receiving unit (3), and an adhesion unit (9) boning the wafer (WF) to the adhesion sheet (AS). The frame receiving unit (3) has a ring frame vertically arranged. |
