发明名称 レーザー加工装置
摘要 PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus that prevents a risk in which a machining head is broken by the disturbance of a liquid column.SOLUTION: A laser beam machining apparatus includes: a holding means for holding a workpiece; and a laser beam emitting means comprising at least a laser oscillator and a machining head and emitting a laser beam onto the workpiece held with the holding means. The machining head is provided with: a condensing lens for condensing a laser beam oscillated from the laser oscillator; a liquid jetting means for forming a liquid column into which the laser beam condensed with the condensing lens is guided by jetting the liquid onto the workpiece; a pipe through which the liquid column formed by the liquid jetting means passes; a gas inflow path which makes the gas, for rectifying the liquid column by surrounding the liquid column, flow into the pipe; and a means for detecting the abnormality of the liquid column for detecting the abnormality of the gas, which flows in the gas inflow path, as the abnormality of the liquid column.
申请公布号 JP6004711(B2) 申请公布日期 2016.10.12
申请号 JP20120088102 申请日期 2012.04.09
申请人 株式会社ディスコ 发明人 森重 幸雄
分类号 B23K26/146;B23K26/00;B23K26/064 主分类号 B23K26/146
代理机构 代理人
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