发明名称 半導体装置
摘要 A semiconductor device includes: a p-type semiconductor layer; an n-type semiconductor layer connected with the p-type semiconductor layer; a first electrode layer formed on the n-type semiconductor layer; and a second electrode layer formed on the p-type semiconductor layer. The first electrode layer and the second electrode layer are electrically connected such as to each operate at an identical potential. The second electrode layer is connected with at least a part of a surface of the first electrode layer which is opposite to a surface of the first electrode layer that is in contact with the n-type semiconductor layer.
申请公布号 JP6007771(B2) 申请公布日期 2016.10.12
申请号 JP20120272985 申请日期 2012.12.14
申请人 豊田合成株式会社 发明人 岡 徹;田中 成明
分类号 H01L29/78;H01L29/12;H01L29/417 主分类号 H01L29/78
代理机构 代理人
主权项
地址