发明名称 METHOD FOR FORMING PHOTOSENSITIVE RESIN LAYER, METHOD FOR PRODUCING PHOTORESIST PATTERN, AND METHOD FOR FORMING PLATED MOLDED OBJECT
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a photosensitive resin layer, a method for producing a photoresist pattern, and a method for forming a plated molded object, by which a profile of a photoresist pattern can be controlled in such a manner that, when a photoresist pattern comprising a photosensitive resin layer is formed by using a chemically amplified positive photosensitive resin composition, the obtained photoresist pattern includes a non-resist portion where a width of the bottom (on a substrate surface side) is larger than a width of the top (on a surface side of the photosensitive resin layer).SOLUTION: The method or forming a photosensitive resin layer comprises: a layer deposition step of depositing a photosensitive resin layer formed of a chemically amplified positive photosensitive resin composition on a metal surface having catalytic activity of a substrate, the resin composition comprising an acid generator (A), a resin (B) that increases the solubility with an alkali by an action of an acid, and an organic solvent (S); and a heating step of heating the photosensitive resin layer. The acid generator (A) comprises an acid generator (A1) that generates an acid by exposure as well as generates an acid by the heating on the metal surface having catalytic activity. The photosensitive resin layer has, by the heating, high solubility in alkali as a site thereof close to the interface with the substrate.SELECTED DRAWING: None
申请公布号 JP2016177018(A) 申请公布日期 2016.10.06
申请号 JP20150055412 申请日期 2015.03.18
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIMURA HIDEKAZU;KUMADA SHINJI;MOMOSAWA AYA
分类号 G03F7/039;G03F7/09;G03F7/20;G03F7/38;G03F7/40 主分类号 G03F7/039
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