发明名称 CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable composition capable of achieving both adhesion strength after a humidity and heat resistance test and storage stability.SOLUTION: In a curable composition, an allylsilane compound (A) represented by following general formula (I), wherein preferably, b is 3, a is 1, and Ris an alkyl group having 1-20 carbon atoms, in particular having a group having an epoxy group or an isocyanurate group, a polymerizable compound (B), and a polymerization initiator (C) are used together. (In the formula, Ris a hydrogen atom, an alkyl group having 1-20 carbon atoms, or the like; a is a number of 0 to 3; b is a number of 1-4; and a and b are numbers satisfying a+b=4.)SELECTED DRAWING: None
申请公布号 JP2016176009(A) 申请公布日期 2016.10.06
申请号 JP20150057690 申请日期 2015.03.20
申请人 ADEKA CORP 发明人 SHINOZUKA TOYOJI;ROKUTANI SHO
分类号 C08F230/08;C08F2/44 主分类号 C08F230/08
代理机构 代理人
主权项
地址