| 摘要 |
Disclosed is a sapphire processing method, comprising cutting a sapphire crystal into a cuboid-shaped block, wherein at least the upper and lower bottom surfaces of the cuboid-shaped block are in the shape of a square, and the side lengths of the block are between 50-60 mm; then, cutting the block into several square substrates having the same or different thicknesses, wherein the side lengths of the upper and lower bottom surfaces of the substrate are equal to that of the upper and lower bottom surfaces of the block; and then cutting the square substrates into several diaphragms, the diaphragms having square or round upper and lower bottom surfaces thereof, and wherein the thicknesses thereof are equal to that of the substrates, and the side lengths of the bottom surface of the square substrate being 4-5 times of the length of the side lengths or diameter of the bottom surface of the diaphragm, plus a 1-5 mm machining allowance. The sapphire processing method provided in the present invention can effectively improve the utilization ratio of sapphire materials in order to minimize the usage-cost of sapphire diaphragms, and can be widely used in the production of sapphire diaphragms. |
