发明名称 ELECTRONIC UNIT
摘要 An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.
申请公布号 US2016295681(A1) 申请公布日期 2016.10.06
申请号 US201615090195 申请日期 2016.04.04
申请人 DENSO CORPORATION 发明人 Yamamoto Toshihisa
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项 1. An electronic unit, comprising: a heat sink that includes a strut; a substrate that is fixed to the strut of the heat sink; a heating component that is mounted on the substrate to generate heat upon energization of the heating component; a temperature sensor that is mounted on the substrate to detect temperature; a first interconnection that is provided in a high-temperature region in which the heating component is mounted on the substrate and that is connected to the strut of the heat sink; and a second interconnection that is provided in a detection region in which the temperature sensor is mounted on the substrate and that is provided separately from the first interconnection, wherein the second interconnection is connected to the strut of the heat sink and the temperature sensor.
地址 Kariya-city JP