MULTI-CAVITY PACKAGE HAVING SINGLE METAL FLANGE

摘要

A multi-cavity package includes a single metal flange having first and second opposing main surfaces, a circuit board attached to the first main surface of the single metal flange, the circuit board having a plurality of openings which expose different regions of the first main surface of the single metal flange, and a plurality of semiconductor dies each of which is disposed in one of the openings in the circuit board and attached to the first main surface of the single metal flange. The circuit board includes a plurality of metal traces for electrically interconnecting the semiconductor dies to form a circuit. A corresponding method of manufacturing is also provided.

主权项

1. A multi-cavity package, comprising:
a single metal flange having first and second opposing main surfaces; a circuit board attached to the first main surface of the single metal flange, the circuit board having a first surface facing the single metal flange, a second surface facing away from the first surface, and a plurality of openings which expose different regions of the first main surface of the single metal flange; and a plurality of semiconductor dies each of which is disposed in one of the openings in the circuit board and attached to the first main surface of the single metal flange, wherein the circuit board comprises a plurality of metal traces for electrically interconnecting the semiconductor dies to form a circuit, wherein the metal traces form a single layer disposed on the second surface of the circuit board, and wherein at least one of the semiconductor dies is an amplifier die.