| 发明名称 |
ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS |
| 摘要 |
An electronic device may include a substrate, an active IC die above the substrate, and a dummy IC die above the active IC die. The electronic device may include a first adhesive layer between the active IC die and the dummy IC die, and a heat sink layer above the dummy IC die and extending laterally outwardly to define a gap between the substrate and opposing portions of the heat sink layer. |
| 申请公布号 |
US2016293512(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201514674156 |
申请日期 |
2015.03.31 |
| 申请人 |
STMICROELECTRONICS PTE LTD |
发明人 |
MA Yiyi;GOH Kim-Yong;ZHANG Xueren |
| 分类号 |
H01L23/367;H01L23/00;H01L25/00;H01L27/18 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a substrate; an active integrated circuit (IC) die above said substrate; a dummy IC die above said active IC die; a first adhesive layer between said active IC die and said dummy IC die; and a heat sink layer above said dummy IC die and extending laterally outwardly therefrom to define an air gap between said substrate and opposing portions of said heat sink layer. |
| 地址 |
Singapore SG |
