发明名称 |
METHOD FOR CREATING THROUGH-CONNECTED VIAS AND CONDUCTORS ON A SUBSTRATE |
摘要 |
A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material has the steps of: (a) depositing a powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias; (b) drying the deposited powder of metallic particles; (c) polishing the powder of metallic powders into the through or blind vias; (d) repeating steps (a)-(c) on a reverse side of the dielectric material; and (e) repeating steps (a)-(d) until no unfilled vias are detected. |
申请公布号 |
US2016293451(A1) |
申请公布日期 |
2016.10.06 |
申请号 |
US201615090164 |
申请日期 |
2016.04.04 |
申请人 |
NanoPac Technologies, Inc. |
发明人 |
Koelling Fred |
分类号 |
H01L21/48;B22F1/00;B22F3/093;B22F3/04;B22F7/04;B22F5/10 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
1. A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material, the method comprising the steps of:
(a) depositing a powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias; (b) drying the deposited powder of metallic particles; (c) polishing the powder of metallic powders into the through or blind vias; (d) repeating steps (a)-(c) on a reverse side of the dielectric material; and (e) repeating steps (a)-(d) until no unfilled vias are detected. |
地址 |
Fremont CA US |