发明名称 METHOD FOR CREATING THROUGH-CONNECTED VIAS AND CONDUCTORS ON A SUBSTRATE
摘要 A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material has the steps of: (a) depositing a powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias; (b) drying the deposited powder of metallic particles; (c) polishing the powder of metallic powders into the through or blind vias; (d) repeating steps (a)-(c) on a reverse side of the dielectric material; and (e) repeating steps (a)-(d) until no unfilled vias are detected.
申请公布号 US2016293451(A1) 申请公布日期 2016.10.06
申请号 US201615090164 申请日期 2016.04.04
申请人 NanoPac Technologies, Inc. 发明人 Koelling Fred
分类号 H01L21/48;B22F1/00;B22F3/093;B22F3/04;B22F7/04;B22F5/10 主分类号 H01L21/48
代理机构 代理人
主权项 1. A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material, the method comprising the steps of: (a) depositing a powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias; (b) drying the deposited powder of metallic particles; (c) polishing the powder of metallic powders into the through or blind vias; (d) repeating steps (a)-(c) on a reverse side of the dielectric material; and (e) repeating steps (a)-(d) until no unfilled vias are detected.
地址 Fremont CA US