发明名称 THERMAL SENSOR ARRANGEMENT AND METHOD OF MAKING THE SAME
摘要 A temperature sensor arrangement in an integrated circuit (IC) includes a sensor array configured to determine a temperature of the IC. The sensor array includes a first transistor having a first terminal, a second terminal and a gate. The temperature sensor array further includes a guard ring region between the sensor array and another circuit of the IC. The guard ring region includes a transistor structure having a first terminal, a second terminal and a gate. The temperature sensor arrangement further includes a thermally conductive element connected to the transistor structure and a first terminal of the first transistor. The thermally conductive element is configured to provide a thermally conductive path from the transistor structure to the first terminal of the first transistor.
申请公布号 US2016290873(A1) 申请公布日期 2016.10.06
申请号 US201514713183 申请日期 2015.05.15
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HORNG Jaw-Juinn;LIU Szu-Lin
分类号 G01K7/00;H01L21/765;H01L27/02;G01R31/28;G01K13/00 主分类号 G01K7/00
代理机构 代理人
主权项 1. A temperature sensor arrangement in an integrated circuit (IC), the temperature sensor arrangement comprising: a sensor array configured to determine a temperature of the IC, wherein the sensor array comprises a first transistor having a first terminal, a second terminal and a gate; a guard ring region between the sensor array and another circuit of the IC, wherein the guard ring region comprises a transistor structure having a first terminal, a second terminal and a gate; and a thermally conductive element connected to the transistor structure and a first terminal of the first transistor, wherein the thermally conductive element is configured to provide a thermally conductive path from the transistor structure to the first terminal of the first transistor.
地址 Hsinchu TW