发明名称 |
THERMAL SENSOR ARRANGEMENT AND METHOD OF MAKING THE SAME |
摘要 |
A temperature sensor arrangement in an integrated circuit (IC) includes a sensor array configured to determine a temperature of the IC. The sensor array includes a first transistor having a first terminal, a second terminal and a gate. The temperature sensor array further includes a guard ring region between the sensor array and another circuit of the IC. The guard ring region includes a transistor structure having a first terminal, a second terminal and a gate. The temperature sensor arrangement further includes a thermally conductive element connected to the transistor structure and a first terminal of the first transistor. The thermally conductive element is configured to provide a thermally conductive path from the transistor structure to the first terminal of the first transistor. |
申请公布号 |
US2016290873(A1) |
申请公布日期 |
2016.10.06 |
申请号 |
US201514713183 |
申请日期 |
2015.05.15 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HORNG Jaw-Juinn;LIU Szu-Lin |
分类号 |
G01K7/00;H01L21/765;H01L27/02;G01R31/28;G01K13/00 |
主分类号 |
G01K7/00 |
代理机构 |
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代理人 |
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主权项 |
1. A temperature sensor arrangement in an integrated circuit (IC), the temperature sensor arrangement comprising:
a sensor array configured to determine a temperature of the IC, wherein the sensor array comprises a first transistor having a first terminal, a second terminal and a gate; a guard ring region between the sensor array and another circuit of the IC, wherein the guard ring region comprises a transistor structure having a first terminal, a second terminal and a gate; and a thermally conductive element connected to the transistor structure and a first terminal of the first transistor, wherein the thermally conductive element is configured to provide a thermally conductive path from the transistor structure to the first terminal of the first transistor. |
地址 |
Hsinchu TW |