发明名称 ADHESIVE COMPOSITION SHEET, PROCESS FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE
摘要 An adhesive composition sheet which comprises organic compounds and inorganic particles, the adhesive composition sheet comprising a structure obtained by superposing at least one layer A comprising an organic compound and at least one layer B comprising an organic compound and inorganic particles, the layer A having a higher organic-compound content than the layer B, and the layer A and/or the layer B containing inorganic particles having an anisotropic shape. The present invention provides an adhesive composition sheet which, after curing, has satisfactory thermal conductivity and insulating properties.
申请公布号 WO2016158268(A1) 申请公布日期 2016.10.06
申请号 WO2016JP57400 申请日期 2016.03.09
申请人 TORAY INDUSTRIES, INC. 发明人 SHINBA, Yoichi
分类号 C09J7/00;C09J5/00;C09J11/04;C09J201/00;H01L21/52;H01L23/36 主分类号 C09J7/00
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