PREPARATION METHOD FOR ELECTRONIC COMPONENTS WITH AN ALLOY ELECTRODE LAYER

摘要

A preparation method for an electronic component with an alloy electrode layer includes steps of printing a metal layer on each of the two opposite surfaces of a ceramic substrate with the metal layer made from aluminum, spraying an alloy layer being a copper alloy layer on an outer surface of each metal layer, connecting a pin to each alloy layer, and enclosing the ceramic substrate, the metal layers, the alloy layers and a portion of each pin with an insulating layer. With the adoption of copper alloy for the alloy layer, the preparation method has the advantages of low production cost and high reliability of the electronic component produced by the method.

主权项

1. A preparation method for an electronic component with an alloy electrode layer, comprising steps of:
preparing a ceramic substrate having two opposite surfaces; printing a metal layer on each of the two opposite surfaces of the ceramic substrate, wherein the material of the metal layer is aluminum; spraying an alloy layer on an outer surface of each metal layer, wherein the alloy layer is a copper alloy layer, and each metal layer and a corresponding alloy layer stacked on the metal layer form an electrode layer; connecting a pin to each alloy layer; and enclosing the ceramic substrate, the electrode layers and a portion of each pin with an insulating layer.