发明名称 |
COMPOSITIONS FOR PREPARING ELECTRICALLY CONDUCTIVE COMPOSITES, COMPOSITES PREPARED THEREFROM, AND ELECTRONIC DEVICES INCLUDING THE SAME |
摘要 |
A composition for preparing an electrically conductive composite includes, based on the total weight of the composition:
about 37 weight percent to about 84 weight percent of an epoxy;about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; andabout 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same. |
申请公布号 |
US2016293290(A1) |
申请公布日期 |
2016.10.06 |
申请号 |
US201615047790 |
申请日期 |
2016.02.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MIZUSAKI Soichiro;LEE Sang Eui;CHANG Won Suk;HAN In Taek |
分类号 |
H01B1/24 |
主分类号 |
H01B1/24 |
代理机构 |
|
代理人 |
|
主权项 |
1. A composition for an electrically conductive composite, comprising, based on a total weight of the composition:
about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. |
地址 |
Suwon-si KR |