发明名称 COMPOSITIONS FOR PREPARING ELECTRICALLY CONDUCTIVE COMPOSITES, COMPOSITES PREPARED THEREFROM, AND ELECTRONIC DEVICES INCLUDING THE SAME
摘要 A composition for preparing an electrically conductive composite includes, based on the total weight of the composition: about 37 weight percent to about 84 weight percent of an epoxy;about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; andabout 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.
申请公布号 US2016293290(A1) 申请公布日期 2016.10.06
申请号 US201615047790 申请日期 2016.02.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 MIZUSAKI Soichiro;LEE Sang Eui;CHANG Won Suk;HAN In Taek
分类号 H01B1/24 主分类号 H01B1/24
代理机构 代理人
主权项 1. A composition for an electrically conductive composite, comprising, based on a total weight of the composition: about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler.
地址 Suwon-si KR
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