| 摘要 |
The present invention provides a photosensitive resin composition which forms a pattern having a rectangular cross section, high resolution and wide light exposure margin, and which is capable of forming a film that has excellent heat resistance. This photosensitive resin composition is characterized by containing (a) a polyimide which has, at an end of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, (b) a monomer, (c) a thermally crosslinkable compound, (d) a photopolymerization initiator and (e) a polymerization inhibitor. This photosensitive resin composition is also characterized in that the polymerization inhibitor (e) is a compound that is obtained by adding at least one hydroxyl group, alkoxy group, aryloxy group or aralkyloxy group to a naphthalene skeleton or an anthracene skeleton of a compound having a naphthalene skeleton or an anthracene skeleton. |
