| 摘要 |
This substrate treatment device is provided with: a substrate holding unit for holding a substrate (9) in a horizontal state; and a treatment solution supply unit for supplying a first treatment solution and a second treatment solution, which has a lower specific gravity and a higher boiling point than the first treatment solution, onto the upper surface (91) of the substrate (9) in order to form on the upper surface (91) of the substrate (9) a first liquid film (71) which is a liquid film of the first treatment solution and a second liquid film (72) which is a liquid film of the second treatment solution covering the upper surface (73) of the first liquid film (71). In this substrate treatment device, the first liquid film (71) is heated at a temperature greater than or equal to the boiling point of the first treatment solution but lower than the boiling point of the second treatment solution, whereby foreign matter on the upper surface (91) of the substrate (9) is removed from the upper surface (91) of the substrate (9) and moved into the second liquid film (72) by the first treatment solution vaporized between the second liquid film (72) and the substrate (9). Consequently, the foreign matter can be properly removed from the substrate (9) while damage to the upper surface (91) of the substrate (9) is suppressed. |
