| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink, a heat dissipation structure, a cooling structure and a device, in which a temperature rise in a heat sink on a leeward side can be minimized without increasing cost.SOLUTION: A heat sink 140 includes a plurality of regions (a first heat sink 141, a second heat sink 142 and a third heat sink 143) along a blowing direction A of air blown from an air blowing section 150. The heat sink 140 is configured such that thermal resistances of the plurality of regions become lower toward a leeward side in the blowing direction A of the air blowing section 150.SELECTED DRAWING: Figure 1 |
