| 摘要 |
Provided is a method for manufacturing a semiconductor device, and a heat-curable adhesive sheet with which it is possible to reduce semiconductor wafer warpage. Prior to being diced, a heat-curable adhesive sheet is affixed to the polished surface of a semiconductor wafer and cured, said sheet containing a polymer that contains an elastomer, a (meth)acrylate including over 95% by weight of a polyfunctional (meth)acrylate in relation to the total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130°C or less, and a light-transmissive filler. As a consequence thereof, the heat-curable adhesive sheet shrinks dramatically and stress acting in the direction opposite that of semiconductor wafer warpage is generated; therefore, the semiconductor wafer can be kept in a flat state. |
