| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat-conductive resin sheet affording favorable handling friendliness in yet-to-be-cured and partially-cured states and excellent in terms of heat resistance, heat conductivity, and electric insulating capacity and to obtain a high-performance, high-reliability semiconductor device for power applications.SOLUTION: The provided thermosetting resin composition is obtained by dispersing a heat-conductive filler 3 within a thermosetting resin matrix 2. The filler 3 is a secondary aggregate 3 formed as a result of the aggregation of primary particles 4. The resin matrix 2 is adjusted so as to yield a post-curing glass transition point of 170°C or above and a pre-curing viscosity at 100°C of 20 Pa s or below. |
