| 摘要 |
PROBLEM TO BE SOLVED: To provide an adsorber which enables a wafer to be easily removed from a stage when an electrostatic chuck is turned off and achieves high adsorption power when the electrostatic chuck is turned on without causing the deterioration and the contamination at the stage.SOLUTION: An electrostatic chuck 10 includes: a stage 11 for fixing a processed wafer 1; a protection film 12 protecting a front surface of the stage 11; conductors 21 selectively provided at the protection film 12; a conductive layer 13 generating a force fixing the processed wafer 1 to the stage 11 between the processed wafer 1 and the stage 11; a cooling part 14 cooling the processed wafer 1; and voltage wiring 15 connecting the conductive layer 13 with a voltage source 16. The conductors 21 provided on the surface of the protection film 12 are covered by an adhesive layer 22. The multiple conductors 21 are disposed on a stage 11 side surface of the protection film 12 at an equal interval in a matrix manner. In this structure, a portion of a surface of the protection film 12, which excludes a portion where the conductors 21 are provided, forms a lattice planar shape. |
