| 摘要 |
A wafer mounting table for probe apparatus and a probe apparatus can uniformly adsorb and hold a semiconductor wafer including an annular portion having a large thickness and a thin portion having a small thickness. The probe apparatus includes a card clamp unit configured to detachably support a probe card; and a wafer mounting table configured to adsorb and hold the semiconductor wafer and bring electrodes formed on the semiconductor wafer into contact with the probes. In order to mount the semiconductor wafer including an annular portion protruding from a rear surface of an outer peripheral portion thereof and a thin portion, as the other portion than the annular portion, having a thickness smaller than that of the annular portion, the wafer mounting table further includes a planar portion on which the thin portion is mounted; and a step-shaped portion which is formed at an edge portion of the planar portion and mounts the annular portion thereon. Further, multiple circular vacuum chuck grooves are concentrically formed in the planar portion, and at least some of the multiple vacuum chuck grooves are connected to multiple vacuum paths through which vacuum evacuation is performed at multiple positions separated from each other by 90° or more along a circumferential direction thereof. |
