| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal filler, a solder paste and an electroconductive adhesive, capable of performing a melt-joining under a reflow heat treatment condition of a lead-free solder, which have the heat resistance that they do not remelt after the joining even when being subjected to a plurality of times of heat treatments in a post process after the joining and superior connection reliability against thermal fatigue after the solder joining.SOLUTION: A metal filler is composed of a mixture of Cu alloy particles and solder particles. In the metal filler, the Cu alloy particle includes one kinds or more of elements selected from a group consisting of Ni, Fe and Co, by 0.01-1 mass%. |
