| 摘要 |
PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding adhesive sheet which has sufficient adhesive characteristics and also heat resistance that can endure high temperature during lead-free solder reflow, and has flex resistance superior to conventional ones.SOLUTION: An electromagnetic wave shielding adhesive sheet includes a conductive layer and an insulating layer. When a repellent force of a polyimide film with a thickness of 25 μm is 100, a repellent force of a sheet (X) is more than 130 but not more than 400. The sheet (X) is obtained by crimping: the electromagnetic wave shielding adhesive sheet; the polyimide film with the thickness of 25 μm; and the electromagnetic wave shielding adhesive sheet under conditions of a temperature of 150°C, a pressure of 2 MPA and for 30 minutes. |
