| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining substrate with through wiring which prevents an electrode from being damaged due to thermal expansion of a resin disposed in a through hole.SOLUTION: A joining substrate with through wiring 10A includes: a first substrate 1 where an electrode layer 2 is formed on one surface 1a; and a second substrate 4 joined to the first substrate 1 through the electrode layer 2 and a joining resin layer 3 and has: a through hole 5 penetrating the first substrate 1 until the electrode layer 2 is exposed from the other surface 1b side of the first substrate 1; a through wiring layer 6 covering an inner side surface 5c of the through hole 5 and the electrode layer 2 in the through hole 5; and a filling resin part 7 covering the through wiring layer 6 and filling the through hole 5. The Young's modulus of a resin forming the filling resin part 7 is smaller than the Young's modulus of a resin forming the joining resin layer 3. |
