| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board in which a crack does not occur in a plating layer covering a copper pattern even when the copper pattern is heated to a recrystallization temperature or higher and characteristics of the copper pattern do not change.SOLUTION: A method for manufacturing a ceramic circuit board according to an embodiment comprises the steps of: heating a copper pattern 2 bonded to at least one surface of a ceramic board 1 directly or via a brazing filler metal to a recrystallization temperature or higher of copper (heating step); and forming a plating layer so as to cover a copper pattern 2A along irregularity of a surface of a copper pattern 2A which passed the heating step (plating step). |
