发明名称 半導体装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing generations of void.SOLUTION: A semiconductor device comprises: a plurality of semiconductor elements arranged in a first direction on a plane; a sealing resin 50 for sealing a plurality of semiconductor elements; a plurality of terminals electrically connected to the plurality of semiconductor elements and having parts protruding in the direction perpendicular to the first direction from a predetermined plane of the sealing resin 50 when viewed from a direction vertical to the plane; and recessed parts arranged at locations opposite to one of the plurality of semiconductor elements respectively when viewed from a direction vertical to the plane and between terminals protruding from the predetermined plane and having a shape recessed from the predetermined plane to one of the semiconductor elements side. The recessed part is a resin injection port when a resin that be the sealing resin 50, is injected.
申请公布号 JP6001472(B2) 申请公布日期 2016.10.05
申请号 JP20130024867 申请日期 2013.02.12
申请人 トヨタ自動車株式会社;株式会社デンソー 发明人 門口 卓矢;奥村 知巳
分类号 H01L21/56;H01L23/28 主分类号 H01L21/56
代理机构 代理人
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