发明名称 |
ELECTRODEPOSITION OF COPPER |
摘要 |
In electrolytic copper plating, an aqueous composition comprising a source of copper ions and at least one alkylene or polyalkylene glycol monoether which is soluble in the aqueous phase and has molecular weight not greater than about 500 for improving the efficacy of other additives such as, for example, levelers and suppressors; and a related plating method. |
申请公布号 |
EP3074552(A1) |
申请公布日期 |
2016.10.05 |
申请号 |
EP20140809258 |
申请日期 |
2014.11.25 |
申请人 |
ENTHONE, INC. |
发明人 |
PANECCASIO, VINCENT;WHITTEN, KYLE;COMMANDER, JOHN;HURTUBISE, RICHARD;ROUYA, ERIC |
分类号 |
C25D3/38;H05K3/00 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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