发明名称 半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit short-circuit between an upper electrode and a lower electrode.SOLUTION: A semiconductor device comprises: a substrate 10; a metallic lower electrode 12 formed on the substrate so as to have a through hole 12a; a dielectric film 14 including a first dielectric film 14a formed on the lower electrode 12 and a second dielectric film 14b formed on a lateral face of the lower electrode 12 in the through hole 12a so as to be connected with the first dielectric film 14a; an upper electrode 16 including a first metal film 16a formed on the first dielectric film 14a and a second metal film 16b formed on a lateral face of the second dielectric film 14b so as to be connected with the first metal film 16a; and an air bridge 18 having an end part 18a which is arranged in the through hole 12a and contacts a lateral face of the second metal film 16b.
申请公布号 JP6003271(B2) 申请公布日期 2016.10.05
申请号 JP20120135062 申请日期 2012.06.14
申请人 三菱電機株式会社 发明人 鍋島 佳明
分类号 H01L21/822;H01L27/04 主分类号 H01L21/822
代理机构 代理人
主权项
地址