| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition yielding a cured product exhibiting a scarce post-heat-history heat resistance variation and expressing a low thermal expansion attribute; a cured product thereof; a print wire board exhibiting a scarce post-heat-history heat resistance variation and excellent in terms of low thermal expansion attribute; and simple manufacturing methods of a modified naphthol novolak resin and an epoxy resin each yielding these performances.SOLUTION: In the provided method for manufacturing a modified naphthol novolak resin (X) wherein a &bgr;-naphthol compound (A), a phenol compound (B), and formaldehyde are reacted in the presence of an alkali catalyst, the used quantity of the alkali catalyst with respect to 1 mole of the total number of phenolic hydroxyl groups possessed by the &bgr;-naphthol compound (A) and the phenol compound (B) is confined to a range of 0.1-2.0 mole. |
